Design and modeling for 3D ICs and interposers

Main Author: Swaminathan, Madhavan (Author)
Other Authors: Han, Ki Jin
Format: Open Shelf
Published: New Jersey: World Scientific, [2014].
Subjects:
LEADER 00836pamja2200205 4500
001 0000042433_0008
005 20160414090000.0
008 150630t20142014njua b 001 0 eng d
020 |a 9789814508599  
040 |a loc 
090 0 0 |a TK7874.893   |b .S93 2014 
100 1 |a Swaminathan, Madhavan   |e author.  
245 1 0 |a Design and modeling for 3D ICs and interposers   |c Madhavan Swaminathan, Georgia Institute of Technology, USA ; Ki Jin Han, Ulsan National Institute of Science and Technology (UNIST), Korea.. 
264 1 |a New Jersey:   |b World Scientific,   |c [2014]. 
300 |a xxi, 354 pages:   |b illustrations (some color);   |c 24 cm.. 
504 |a Includes bibliographical references and index. 
650 0 |a Three-dimensional integrated circuits.  
650 7 |a Three-dimensional integrated circuits.  
700 1 |a Han, Ki Jin  
999 |a 0000058347