Fundamentals of Microsystems Packaging
| Main Author: | Tummala |
|---|---|
| Format: | Open Shelf |
| Published: |
New York:
McGraw-Hill,
c2001
|
| Series: |
McGraw-Hill International Edition- Electronic Series
|
| Subjects: |
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|---|---|---|---|
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| 090 | 0 | 0 | |a TK7870.15 |b T86 2001 |
| 100 | 0 | |a Tummala | |
| 245 | 0 | 0 | |a Fundamentals of Microsystems Packaging |c Rao R. Tummala |
| 260 | |a New York: |b McGraw-Hill, |c c2001 | ||
| 300 | |a vii,967p: |b ill; |c 24cm | ||
| 490 | 0 | |a McGraw-Hill International Edition- Electronic Series | |
| 500 | |a Includes index | ||
| 650 | 0 | 0 | |a Microelectronic |
| 999 | 0 | 0 | |a 002365 |
| 999 | |a 0000044566 | ||