Electronic assembly fabrication : Chips, circuit boards, packages, and components

Main Author: Harper
Format: Open Shelf
Published: New Yoark: McGraw-Hill, c2002
Edition: 1st ed
Subjects:
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090 0 0 |a TK7870   |b H373 2002 
100 0 |a Harper  
245 0 0 |a Electronic assembly fabrication :   |b Chips, circuit boards, packages, and components   |c Charles A. Harper 
250 |a 1st ed  
260 |a New Yoark:   |b McGraw-Hill,   |c c2002 
300 |a xv 672p:   |b ill;   |c 24cm. 
504 |a Includes bibliographical references and index  
650 0 0 |a Fabrication processes   |x Assembling, soldering   |x Environmental rules 
999 0 0 |a 000497 
999 0 0 |a 004519 
999 |a 0000138822 
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