Advanced Materials for Thermal Management of Electronic Packaging
| Main Author: | Xingcun Colin Tong |
|---|---|
| Format: | Open Shelf |
| Published: |
New York:
Springer,
2011.
|
| LEADER | 00451pamja2200157 4500 | ||
|---|---|---|---|
| 001 | 0000026861_0009 | ||
| 005 | 20150129090000.0 | ||
| 002 | 0000001606 | ||
| 008 | 141027 | ||
| 020 | |a 9781441977588 | ||
| 090 | 0 | 0 | |a TK7870.15 .T662 2011 |
| 100 | 0 | |a Xingcun Colin Tong | |
| 245 | 0 | 0 | |a Advanced Materials for Thermal Management of Electronic Packaging |c Xingcun Colin Tong. |
| 260 | |a New York: |b Springer, |c 2011. | ||
| 300 | |a xxi,616p: |b ill; |c 24cm. | ||
| 999 | |a 0000032287 | ||