APA Citation

Xingcun Colin Tong. (2011). Advanced Materials for Thermal Management of Electronic Packaging. New York: Springer.

Chicago Style Citation

Xingcun Colin Tong. Advanced Materials for Thermal Management of Electronic Packaging. New York: Springer, 2011.

MLA Citation

Xingcun Colin Tong. Advanced Materials for Thermal Management of Electronic Packaging. New York: Springer, 2011.

Warning: These citations may not always be 100% accurate.