Xingcun Colin Tong. (2011). Advanced Materials for Thermal Management of Electronic Packaging. New York: Springer.
Chicago Style CitationXingcun Colin Tong. Advanced Materials for Thermal Management of Electronic Packaging. New York: Springer, 2011.
MLA CitationXingcun Colin Tong. Advanced Materials for Thermal Management of Electronic Packaging. New York: Springer, 2011.
Warning: These citations may not always be 100% accurate.