Advanced Materials for Thermal Management of Electronic Packaging
| Main Author: | Xingcun Colin Tong |
|---|---|
| Format: | Open Shelf |
| Published: |
New York:
Springer,
2011.
|
MARA-JAPAN INDUSTRIAL INSTITUTE
| Call Number: |
TK7870 15 T662 2011 |
|---|
| Accession | Item Category | SMD | Status | Due Date | Notes |
|---|
| 0000032287 | OPEN SHELF | BOOK | AVAILABLE |