Integrated Circuit Packaging,Assembly and Interconnections
| Main Author: | William J.Greig |
|---|---|
| Format: | Open Shelf |
| Published: |
London,N.Y:
Springer Heidelberg Dordrecht,
2007.
|
MARA-JAPAN INDUSTRIAL INSTITUTE
| Call Number: |
TK7874 G74 2007 |
|---|
| Accession | Item Category | SMD | Status | Due Date | Notes |
|---|
| 0000032281 | OPEN SHELF | BOOK | AVAILABLE |