Integrated Circuit Packaging,Assembly and Interconnections
| Main Author: | William J.Greig |
|---|---|
| Format: | Open Shelf |
| Published: |
London,N.Y:
Springer Heidelberg Dordrecht,
2007.
|
| LEADER | 00458pamja2200157 4500 | ||
|---|---|---|---|
| 001 | 0000026855_0009 | ||
| 005 | 20150129090000.0 | ||
| 002 | 0000001600 | ||
| 008 | 141027 | ||
| 020 | |a 9780387281537 | ||
| 090 | 0 | 0 | |a TK7874 .G74 2007 |
| 100 | 0 | |a William J.Greig | |
| 245 | 0 | 0 | |a Integrated Circuit Packaging,Assembly and Interconnections |c William J.Greig. |
| 260 | |a London,N.Y: |b Springer Heidelberg Dordrecht, |c 2007. | ||
| 300 | |a xxiv,296p: |b ill; |c 24cm. | ||
| 999 | |a 0000032281 | ||