Integrated Circuit Packaging,Assembly and Interconnections
| Main Author: | William J.Greig |
|---|---|
| Format: | Open Shelf |
| Published: |
London,N.Y:
Springer Heidelberg Dordrecht,
2007.
|
| Physical Description: |
xxiv,296p: ill; 24cm. |
|---|---|
| ISBN: |
9780387281537 |