APA Citation

William J.Greig. (2007). Integrated Circuit Packaging,Assembly and Interconnections. London,N.Y: Springer Heidelberg Dordrecht.

Chicago Style Citation

William J.Greig. Integrated Circuit Packaging,Assembly and Interconnections. London,N.Y: Springer Heidelberg Dordrecht, 2007.

MLA Citation

William J.Greig. Integrated Circuit Packaging,Assembly and Interconnections. London,N.Y: Springer Heidelberg Dordrecht, 2007.

Warning: These citations may not always be 100% accurate.