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| LEADER |
00662pamja2200193 4500 |
| 001 |
0000026747_0009 |
| 005 |
20161130090000.0 |
| 002 |
0000001491 |
| 008 |
140904 |
| 020 |
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|a 9780470827802
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| 090 |
0 |
0 |
|a TK7870.15
|b .L582 2011
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| 100 |
1 |
|
|a Liu, Sheng
|
| 245 |
1 |
0 |
|a Modeling and simulation for microelectronic packaging assembly :
|b manufacturing, reliability, and testing
|c Sheng Liu, Yong Liu..
|
| 260 |
|
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|a Beijing:
|b Chemical Industry Press,
|c c2011.
|
| 300 |
|
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|a xxii, 564 p.:
|b ill.;
|c 26 cm.
|
| 504 |
|
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|a Includes bibliographical references and index
|
| 650 |
|
0 |
|a Microelectronic packaging
|x Simulation methods
|
| 700 |
1 |
|
|a Liu, Yong
|
| 999 |
|
|
|a 0000032012
|
