Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing
| Main Author: | Liu, Sheng |
|---|---|
| Other Authors: | Liu, Yong |
| Format: | Open Shelf |
| Published: |
Beijing:
Chemical Industry Press,
c2011.
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| Subjects: |
| Physical Description: |
xxii, 564 p.: ill.; 26 cm. |
|---|---|
| Bibliography: |
Includes bibliographical references and index |
| ISBN: |
9780470827802 |