APA Citation

Liu, S., & Liu, Y. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability, and testing. Beijing: Chemical Industry Press.

Chicago Style Citation

Liu, Sheng, and Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability, and Testing. Beijing: Chemical Industry Press, 2011.

MLA Citation

Liu, Sheng, and Yong Liu. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability, and Testing. Beijing: Chemical Industry Press, 2011.

Warning: These citations may not always be 100% accurate.