Modeling and simulation for microelectronic packaging assembly : manufacturing, reliability, and testing
| Main Author: | Liu, Sheng |
|---|---|
| Other Authors: | Liu, Yong |
| Format: | Open Shelf |
| Published: |
Beijing:
Chemical Industry Press,
c2011.
|
| Subjects: |
MARA-JAPAN INDUSTRIAL INSTITUTE
| Call Number: |
TK7870 15 L582 2011 |
|---|
| Accession | Item Category | SMD | Status | Due Date | Notes |
|---|
| 0000032012 | OPEN SHELF | BOOK | AVAILABLE |