Fundamentals of microsystems packaging : chapter 1-chapter 4

Main Author: Tummala, Rao R.
Format: Open Shelf
Published: USA: McGraw Hill Professional Publishing, c2000.
Subjects:
LEADER 00814pamja2200265 4500
001 0000025982_0009
005 20161122090000.0
002 0000000705
008 110811
020 |a 9780071371698  
090 0 0 |a TK7870.15   |b .T86 2000 
100 1 |a Tummala, Rao R.  
245 1 0 |a Fundamentals of microsystems packaging :   |b chapter 1-chapter 4   |c Rao R. Tummala. 
260 |a USA:   |b McGraw Hill Professional Publishing,   |c c2000. 
300 |a vii, 967 p.:   |b ill. col.;   |c 24cm. 
504 |a  Includes bibliographical references and index 
650 0 |a Electronic packaging  
650 0 |a Microelectronic packaging  
650 0 |a Miniature electronic equipment   |x  Packaging  
999 |a 0000031481 
999 |a 0000031482 
999 |a 0000031483 
999 |a 0000031487 
999 |a 0000031491 
999 |a 0000031492